izmo Microsystems (izmomicro), the semiconductor division of izmo, today announced a Memorandum of Understanding (MoU) with CCRAFT SA, a Swiss thin-film lithium niobate (TFLN) photonic chip foundry, and Alcyon Photonics SL, a Madrid-based leader in integrated photonics IP design. The tri-party collaboration establishes a framework for jointly designing, producing, and commercialising advanced photonic integrated circuit (PIC) solutions for the datacom, telecom, aerospace, and sensor markets. The partnership unites three specialised entities across the photonics value chain. CCRAFT, spun out of CSEM (the Swiss Centre for Electronics and Microtechnology), operates an ISO certified 150 mm wafer foundry and is among a select few companies globally manufacturing TFLN photonic chips at scale � enabling electro-optic modulators exceeding 400 Gbit/s. Alcyon Photonics delivers validated, fabrication-ready photonic IP designs with proven architecture libraries, accelerating the path from prototype to volume production.izmomicro brings to the collaboration its advanced semiconductor packaging and co packaged optics capabilities � the essential �last mile� of photonics commercialisation. The company recently achieved a significant breakthrough in silicon photonics packaging, becoming the first Indian company to demonstrate end-to-end silicon photonics packaging capability spanning design, simulation, optical alignment, fibre-attach, hermetic sealing, and full system-level testing. Operating from a Class 1000 cleanroom in Bangalore with 3D die stacking, flip-chip assembly, fine-pitch wire bonding, and co-packaged optics capabilities, izmomicro`s packaging infrastructure is critical for translating photonic chip designs into production-ready systems � a capability in high demand globally but scarce, positioning India as a credible participant in the global silicon photonics supply chain. Under the MoU, the three companies will collaborate on delivering Alcyon`s photonic IP libraries to customers, joint design and production of photonic systems, and commercialisation of jointly developed solutions. izmomicro has been designated as a preferred packaging partner and will provide design guidelines to optimise photonic integrated circuits for advanced packaging from the outset. The partnership positions izmomicro within Europe`s advanced photonics ecosystem, where the European Chips Act has made photonics a strategic priority. By partnering with CCRAFT in Switzerland and Alcyon in Spain, izmomicro establishes an India-Europe technology bridge combining India`s semiconductor packaging infrastructure with Europe`s chip design and foundry leadership � the model envisioned under India`s Aatmanirbhar Bharat semiconductor initiative. Powered by Capital Market - Live News

Net profit of IZMO rose 93.07% to Rs 11.70 crore in the quarter ended December 2025 as against Rs 6.06 crore during the previous quarter ended December 2024. Sales rose 0.75% to Rs 59.11 crore in the quarter ended December 2025 as against Rs 58.67 crore during the previous quarter ended December 2024. ParticularsQuarter EndedDec. 2025Dec. 2024% Var. Sales59.1158.67 1 OPM %23.8014.10 - PBDT16.5110.38 59 PBT11.946.45 85 NP11.706.06 93 Powered by Capital Market - Live News

Izmo will hold a meeting of the Board of Directors of the Company on 11 February 2026.Powered by Capital Market - Live News

IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This achievement leverages an advanced 3D SiP architecture with stacked substrates to meet the reliability standards required for space-grade electronics.By re-engineering traditional the 200 mm � 200 mm PCB-based electronics into a compact 81 mm � 81 mm SiP module, izmo Microsystems has realized an 84% reduction in footprint. This is achieved through the integration of active components in bare-die form onto a stacked-substrate configuration using high-density wire bonding. This approach enables high routing density and multi-function integration while maintaining the compact dimensions necessary for space-constrained environments.The module is enclosed in a fully indigenized custom Hermetic Ceramic Package, designed and fabricated in India. This hermetic solution is engineered for the environmental robustness and long-term performance essential for the extreme thermal and vacuum conditions of space. Mastering this level of integration is a significant technical hurdle, as it requires managing high-density signal integrity and thermal dissipation within a small volume.This achievement represents a major advancement in India`s semiconductor mission and the Make in India initiative. While standard SiP solutions typically focus on commercial electronics, izmo Microsystems` achievement represents a shift into advanced 3D heterogeneous integration for space electronics. Dinanath Soni, Executive Director of izmo Microsystems, stated: The successful realization of this 3D SiP module validates our technical roadmap and our ability to execute on highly complex semiconductor packaging requirements. By migrating space electronics to integrated 3D architectures, we provide a viable solution for the `NewSpace` industry where mass and volume reduction are critical factors. This achievement confirms our end-to-end competency in space-grade miniaturization and our commitment to building high-value intellectual property within India.Powered by Capital Market - Live News

Net profit of IZMO declined 57.99% to Rs 12.56 crore in the quarter ended September 2025 as against Rs 29.90 crore during the previous quarter ended September 2024. Sales rose 2.66% to Rs 60.11 crore in the quarter ended September 2025 as against Rs 58.55 crore during the previous quarter ended September 2024. ParticularsQuarter EndedSep. 2025Sep. 2024% Var. Sales60.1158.55 3 OPM %22.4916.19 - PBDT17.5740.74 -57 PBT13.1636.78 -64 NP12.5629.90 -58 Powered by Capital Market - Live News